As the electronics industry tend to be complex, from components, electronic components to the product form is varied, the need of various types of organic silicon products and form a complete set, and electronic industry applications of organic silicon products mostly belongs to the fine chemicals, technical characteristics and market demand of the electronics industry, the need to develop targeted series of organic silicon products and systems.
Organic silicon products - thermal management materials
With the high power and miniaturization of electronic components, the heating power of electronic components is getting higher and higher. The heat generated by the heating device needs a good thermal interface material to effectively transfer the heat to the environment, so as to avoid overheating of electronic components resulting in product performance and life problems.
Thermal conductive silicone

Product description: Wanhua chemical thermal silicone grease series products have good thermal conductivity and excellent interface contact, can make heat conduction smooth, at the same time with low oil separation and appropriate rheological properties, not only to ensure long-term thermal conductivity of products and easy to use.
Application: it can be used for cooling computer, power supply and automobile electronics. Such as CPU, communication equipment, power module, LED lamps and lanterns.
Thermal conductive adhesive

Thermal conductive adhesive series products are thermal conductive silicone curing adhesive at room temperature.
· Dealcoholized room temperature curing silicone rubber
· Effectively disperse heat generated by electronic components
· Excellent flame retardant performance, through THE UL94V-0 certification
· Excellent electrical insulation performance
· Fully cured after 48 hours in compliance with RoHS environmental requirements
Product use:
· Power module assembly and reinforcement
· Bonding of electronic components
· Lamp assembly
· Automobile parts assembly
Thermal conductive gel

· Two-component thermal conductive gel with 1:1 addition molding
· Curing at room temperature, heating can accelerate curing
· Low hardness for low stress applications excellent thermal conductivity
· Wide operating temperature range