Organic electroluminescent device (OLED) is a new type of flat display device developed recently. Compared with other display technologies (CTR flat /LCD liquid crystal /PDP plasma), OLED has the advantages of low voltage on and drive, and can be driven by DC. It can be matched with scale integrated circuit and easy to achieve full color. High luminance (> 105cd/m2) and other advantages, but the service life of OLED devices can not meet the application requirements, one of the technical difficulties to be solved is the packaging materials and packaging technology of the devices.
At present, the United States, Japan, Europe and other countries widely used organic silicone modified epoxy resin, namely through blending, copolymerization, or between graft reaction and achieve both can reduce internal stress of epoxy resin and can form the intramolecular toughening, improve the high temperature resistant performance, colleagues also improve organic silicon waterproof, prevent oil, antioxidant performance, but its temperature need a longer cure time (a few hours to a few days), In order to accelerate the curing reaction, it is necessary to use higher temperature (60℃ to 100℃) or increase the use of curing agent, which not only increases the cost, but also difficult to meet the requirements of packaging materials for large-scale device production lines (short time, room temperature packaging).