1. Thermal conductive silicone sheet (also known as thermal conductive silicone pad, thermal silicon film)
With good thermal conductivity and high grade pressure resistance, in line with the current demand for thermal conductivity materials in the electronics industry, it is the best product to replace the binary heat dissipation system of silicone grease thermal paste and mica sheet. This kind of product is easy to install, conducive to automatic production and product maintenance, is a new material with great technology and practicability. Thermal conductive silicone slice thickness, hardness can be adjusted depending on the design, thus can bridge the cooling structure in the thermal channel, chip size difference, such as lowering the difference of structure of cooling device in the design of interface work requirements, especially for flatness and roughness of the work is poor, if improve the processing precision will improve the product cost to a great extent, Therefore, the thermal silicone sheet can fully increase the contact area between the heating element and the cooling device, and reduce the production cost of the radiator.

2. Thermal grease
Thermal silicone grease is a kind of white or gray thermal insulating viscous object, the material has a certain viscosity, no obvious particle sense, non-toxic, tasteless, non-corrosive, stable chemical and physical properties and has excellent thermal conductivity, electrical insulation, high temperature resistance, aging resistance and waterproof properties. In general, thermal silicone grease is insoluble in water, not easy to be oxidized, but also has a certain lubricity and electrical insulation. TSP700 thermal silicone grease also has low oil separation (tends to zero), and very good weather resistance (including high temperature and low temperature resistance, water resistance, ozone resistance, climate aging resistance, etc.), can be used in the temperature of -30℃ ~ 150℃ for a long time, even in +200℃ above the temperature can still keep the contact surface wet.

3. Thermal silicone tape
Widely used in the bonding between power devices and radiators, can simultaneously realize the functions of heat conduction, insulation and fixation, can effectively reduce the volume of equipment, is a favorable choice to reduce the cost of equipment.

4. Thermal silicon tape
With glass fiber as the base material for reinforcement of silicone polymer elastomer, and was named thermal conductive silicone cloth, tearing resistant silicone cloth, this kind of silicone cloth can effectively reduce the electronic component and the radiator, the thermal resistance between the and electrical insulation, high dielectric strength, good thermal conductivity, high chemical performance, resist the pierced by high voltage and metal parts due to the short circuit.

5. Thermal conductivity phase change materials
Using the characteristics of the substrate, phase transformation occurs at the working temperature, so that the material is more fit to the contact surface, but also obtained ultra-low thermal resistance, more thorough heat transfer.

6, heat conduction filler (heat conduction gel, heat conduction filler)
Thermal filler, designed to optimize dispensing control, achieve more excellent thermal conductivity and mechanical properties, and has the advantage of high engineering. Because it is dispensed in a liquid state, the material exerts little stress on the parts during assembly. Can be used to connect and coat the most complex forms and multi-layer surfaces, providing unlimited thickness coverage for uneven board forms.

7. High thermal conductivity potting adhesive
It is a two-component silicone rubber, consisting of two parts of liquid AB. After mixing according to the proportion, it is cured into a high-performance elastomer through reaction. Provide excellent heat dissipation, moisture-proof potting protection for circuit board components.

8. Thermal bonding adhesive
Single component room temperature curing silicone rubber has excellent adhesion to metal, plastic and ceramic surfaces after curing. It is widely used in filling and fixing between electronic components and radiators to improve thermal conductivity and improve the stability of components. Especially structures that cannot be mechanically fixed.