Recommendation of enterprises in this period
Beijing zhenkunhang Trade Co., Ltd
Booth No.: 3a056
Company profile
Beijing zhenkunhang Trade Co., Ltd. was founded in June 2001, is a professional distribution of organic silica gel adhesive company. He not only sells organic silica gel, but also provides customers with bonding scheme and process, supporting equipment, etc. Our agent products are maitu silicone, Henkel loctite adhesive, and some products of Dow Corning. We have 10 years of experience in adhesive industry. For the silicone sales enterprises in the northern region, Beijing zhenkunhang has been among the top enterprises. In particular, our agent, metu silica gel, has an annual growth rate of 40% in the past four years. Now we have become the only RTV silica gel agent in the north area of maitu. Maitu supports us to expand our business in the north area and often organizes technical, marketing and sales personnel to help us run customers. Our products cover a wide range, such as solar energy, automotive electronics, new energy vehicles, led and lighting, home appliances, mobile phones and computers, aerospace, high-speed rail, etc. we can say that where there are circuit boards, there are our products. It is mainly used to assemble circuit board, protect circuit board and improve the reliability of devices. Beijing Zhenkun bank has a huge customer base, and has very good customers in all markets. For example, the solar energy market has Baoding Yingli, Langfang Xinao, etc.
Company products
Product introduction xe14-b7892 potting adhesive two component rubber addition curing
Product model
XE14-B7892
Characteristic
Flame retardant
Appearance
black
Mix ratio ((a): (b))
100:100
thermal conductivity
0.84{2.0×10-3}
Viscosity (after mixing)
1.3{1.3}
Application period (23 ℃) H
Two
Curing condition ℃ / h
Jan-60
Density (23 ℃) g / cm3
One point three nine
Hardness (Shore A)
Sixty
Tensile strength MPa {kgf / cm2}
3.5{36}
Elongation%
One hundred
Bonding strength MPa {kgf / cm2}
-
Linear expansion 1 / K
1.9×10-4
Thermal conductivity w / (m · K)
0.44{1.1×10-3}
Product introduction: two component condensation curing potting adhesive
Curing type
Condensation curing
Product model
TSE3664
Characteristic
Flame retardant
performance
mobility
Appearance
ash
Mix ratio ((a): (b))
40:07.5
Viscosity (after mixing)
3.0{30}
Application period (23 ℃) H
Zero point one
Curing condition ℃ / h
23/72
Density (23 ℃) g / cm3
One point four one
Hardness (Shore A)
Sixty-five
Tensile strength MPa {kgf / cm2}
4.0{40}
Elongation%
Eighty
Bonding strength MPa {kgf / cm2}
1.0{10}
Linear expansion 1 / K
-
Thermal conductivity w / (m · K)
0.44{1.1×10-3}
Volume resistivity
1.0×107
Dielectric strength kV / mm
Twenty
Dielectric constant (60Hz)
Three point one
Dielectric loss factor (60Hz)
Zero point zero one
Remarks
UL94 V-0 adhesion
Source: Beijing Zhenkun
In the 5g era, the functions of intelligent devices are becoming more and more complex, the integration of chips and modules and the density of parts are increasing rapidly, which leads to the continuous improvement of power consumption and heating density of devices. Therefore, the new heat conduction and cooling materials have become an important research topic "cime 2020" The exhibition will focus on the latest products and technologies of the heat conduction and heat dissipation materials industry, establish a brand image for enterprises, promote trade cooperation and market development, lead the industry trend, strengthen the interaction of production, research and development and sales, deeply understand the future development trend of the heat conduction and heat dissipation materials market at home and abroad, and tap the future of the heat conduction and heat dissipation materials market with a development perspective New demands, innovation of exhibition connotation, all-round and multi-level organization of professional visitors provide the best platform for technical exchange, product display and trade negotiation for exhibitors and participants. The 2020 Shenzhen International heat conduction and cooling materials exhibition will be held in Shenzhen Convention and Exhibition Center from August 27 to 29, 2020. At that time, warmly welcome domestic and foreign heat conduction and heat dissipation material enterprises and related industry to visit and exchange!
Target audience: we mainly invite relevant scientific research institutions, consumer electronics, power supply, automobile industry, electronics, household appliances, computers / computers and components, displays, semiconductors, military products, photoelectric / LED, frequency converters, mechanical industry, electronic equipment, electronic components, instruments and meters, communication / communication network, medical instruments, wind power, sun Leaders of Neng, case / cabinet, choke, integrated circuit, transistor, electrical appliances, transformer, welding equipment, power electronic devices and other enterprises visited and discussed at the meeting. Cime 2020 Shenzhen International heat conduction and heat dissipation materials and equipment exhibition is committed to promoting the rapid development of heat conduction and heat dissipation materials industry and creating a trustworthy new material business platform! August 27-29, 2020 Shenzhen Convention and Exhibition Center (Fuhua Third Road, Futian District) looks forward to your arrival
Booth sales has started in 2020. Please contact Mr. Lu for early bird discount
Tel.: + 86 21 54476198 Mobile: 176-2185-0289 (same as wechat)
Email: lumingliang87@foxmail.com cooperation and contribution: 751770376@qq.com
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