On April 21, 2026, Shanghai Yondi New Materials released a new phenyl vinyl silicone resin. Featuring a Si–O–Si backbone with phenyl and vinyl groups, the material forms a highly cross‑linked 3D network, cage or spherical structure, with heat resistance over 200℃ and refractive index of 1.53–1.55, combining rigid framework and high reactive double bonds. Cross‑linking degree, phenyl and vinyl contents are precisely adjustable to balance heat resistance, hardness, transparency and curing rate, compatible with addition curing systems. Core applications cover Mini/Micro‑LED packaging, heat‑resistant coatings, silicone rubber reinforcement, electronic potting, new energy and automotive electronics, greatly enhancing transparency, weatherability and insulation reliability. As a high‑end silicone material, its industrialization will upgrade optoelectronic display, electronics and new energy industries, providing key support for high‑power devices and harsh environment applications.
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