On May 9, 2026, an application and selection guide for potting compounds tailored to different temperature scenarios was officially released in the electronic packaging industry, providing a clear basis for material selection in electronics, new energy, automotive and high-end manufacturing sectors. The guide categorizes potting compounds into four types by curing temperature to meet diverse application needs. Low-temperature curing compounds work at 0–25℃ without heating, suitable for outdoor low-temperature environments and sensitive components. Room-temperature ones are easy to operate and cost-effective for general electronic modules. Medium-temperature (60–100℃) variants feature balanced properties and high efficiency, ideal for mass production of new energy electronic controls and automotive modules. High-temperature (120–180℃) types excel in heat resistance, insulation and pressure resistance, perfect for harsh environments like automotive high-temperature cabins, military and aerospace fields. The guide clarifies temperature ranges, curing parameters, material systems and applications, with selection tips to help enterprises quickly match solutions, improve product reliability and production efficiency, and promote standardized upgrading of electronic packaging processes. For more information, please visit: https://www.tiktok.com/@mia_iota/video/7597717976720149782