Materials Frontier | New breakthrough of phenyltrimethoxysilane in the electronics industry
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Phenyltrimethoxysilane (CAS: 2996-92-1) is becoming an important player in the research and development of electronic-grade silicon materials due to its excellent thermal stability and low dielectric properties.
Its phenyl structure gives the material good electrical insulation and heat resistance, and is particularly suitable for:
Microelectronics packaging
Chip protection coating
Low modulus electronic adhesive
In addition, it can also participate in the preparation of high-performance organic-inorganic hybrid materials, providing support for electrical insulation solutions in the 5G and new energy fields.
The value of phenylsilane is rising with the demand for highly integrated and miniaturized electronic products.
