December 16, 2025 - With the rapid development of 5G, artificial intelligence, new energy vehicles and other industries, the heat dissipation demand for high-power consumption electronic devices is increasingly urgent. Thermal silicone gel, as a key material with both high thermal conductivity and adaptability, has been widely used in core fields such as consumer electronics, data centers and automotive electronics. Meanwhile, the group standard "Thermal Conductive Silicone Gel for Electronic Equipment" drafted by Beijing Sino Advanced Chemical Materials Institution has been successfully approved, which will fill the gap in industry norms and support the high-quality development of the industry.

Thermal silicone gel is a thermal interface material that remains semi-solid after curing, with significant core advantages: its thermal conductivity ranges from 2.9 to 12 W/(m·K), enabling efficient heat transfer from chips; the paste-like application and gel-forming characteristics allow it to fill micro gaps, adapting to complex structures and vibration environments; it has a wide operating temperature range of -45℃ to 150℃, and the low oil bleeding and aging resistance ensure long-term reliability of equipment. Additionally, its good electrical insulation makes it safe for use in precision circuits.
Its application scenarios have fully penetrated high-end manufacturing: consumer electronics such as 400G/800G optical modules and smartphones rely on it for efficient heat dissipation; high heat flux density devices such as AI server GPUs and data center chips maintain high-load operation through it; key components of new energy vehicles such as IGBT modules and battery management systems use it to cope with vibration and temperature fluctuations. Compared with thermal grease and thermal silicone pads, thermal silicone gel has more advantages in gap-filling ability, stability and automation adaptability, making it the preferred solution for complex scenarios.
The approval of the group standard "Thermal Conductive Silicone Gel for Electronic Equipment" will standardize key indicators such as product thermal conductivity, thermal resistance and dielectric strength, and clarify testing methods and application requirements. To ensure the scientificity and feasibility of the standard, Beijing Sino Advanced Chemical Materials Institution sincerely invites relevant enterprises to participate in the formulation. Interested parties can contact He Li (Tel: 19907121608, Email: heli@acmi.org.cn) or Li Jie (Tel: 18971475939, Email: lijie@acmi.org.cn) for consultation and cooperation. The implementation of this standard will further promote industrial technological upgrading and provide more reliable material guarantees for downstream industries.

Data source: WeChat Official Account SAGSI Organic Silicon