In January 2026, the cutting-edge polymer material thermal conductivity technology has entered a crucial development stage. By constructing efficient heat conduction channels, this technology has successfully solved the industry problem of low thermal conductivity of traditional plastics, promoting thermal conductive materials from the "simple filler" era to the "structural engineering" era, and providing innovative solutions for new energy, 5G communication and other fields.
    Polymer materials themselves have a thermal conductivity of only 0.1‑0.5 W/(m·K), mainly restricted by factors such as low phonon transmission efficiency, disordered molecular chains, and large interfacial thermal resistance. Current mainstream solutions focus on three core strategies: 3D network support skeleton builds low-resistance thermal conduction channels through three-dimensional interconnected structures while balancing mechanical strength; interface modification technology reduces thermal resistance between fillers and matrix, avoiding the negative impact of excessive modification on thermal conductivity; phase change material composite effectively addresses transient high-temperature issues, adapting to electronic component packaging needs.
    From 2025 to 2026, frontier materials and preparation technologies have shown remarkable highlights. Carbon-based composites achieve significant improvement in thermal conductivity with a low filler content of less than 3%. Hybrid fillers complement properties such as insulation and thermal conductivity, hardness and strength to meet diverse requirements. Low-dimensional material self-assembly and directional stretching technologies further optimize thermal channel structures, with oriented graphene sheets and "needle-like" nanotube channels greatly improving thermal conductivity efficiency.
    Application scenarios continue to expand: new energy vehicle motors adopt SiO₂/BN composite fillers + 3D skeleton structure to meet high power density requirements; 5G/6G base station power amplifiers use graphene composites to achieve low-resistance heat dissipation in small volumes; flexible composite films in consumer electronics combine thinness, flexibility and thermal conductivity; high-temperature resistant ceramic/polymer composites in aerospace can withstand extreme environments. Data shows that through 3D network construction, a filler volume fraction of less than 30% can achieve a thermal conductivity of over 10 W/(m·K).
    In the future, low filler content with high thermal conductivity, flexible wearable thermal management and green manufacturing will become core development directions. The promotion of solvent-free and low-temperature sintering technologies will further reduce industrial energy consumption, driving the large-scale application of this technology in more high-end manufacturing fields.

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