January 13, 2026 - As an important thermosetting resin system derived from polyimide (PI) resin, bismaleimide (BMI) continues to play a key role in high-end fields such as aerospace, military industry, and semiconductors due to its excellent comprehensive properties. Recently, researchers have successfully addressed the industry pain points of high brittleness and poor processability through molecular structure modification technology, further expanding the application boundaries of this material.
    The benzene rings and imide rings in the molecular structure of bismaleimide endow it with high temperature resistance above 350℃, excellent flame retardancy and mechanical properties, making it one of the preferred materials for structural components in the aerospace field, widely used in key parts such as aircraft fuselages and skeletons. At the same time, its low dielectric constant has also established its important position in the semiconductor circuit board and copper-clad laminate markets. However, the excessively high crosslinking density leads to high brittleness of the cured product, which has long restricted its in-depth application in high-performance material engineering.
     To achieve balanced performance, research teams have started from the molecular structure, increasing the segment length and introducing flexible segments such as ether bonds to improve toughness while retaining heat resistance to the greatest extent. In addition, the introduction of functional groups such as phosphorus and silicon has endowed the resin with special properties such as flame retardancy and hydrophobicity, and significantly improved solubility and processability. Notably, the ternary system prepared by blending with epoxy resin has shown excellent application potential in aerospace load-bearing structures, high-temperature electronic packaging and other scenarios; the self-healing network constructed through Diels-Alder reaction has also provided a new solution for the field of smart materials.
    Currently, modified bismaleimide resin has been widely used in three major fields: aerospace, semiconductors and smart materials. With the continuous iteration of modification technology, its market share in the high-end manufacturing field is expected to expand further, injecting strong momentum into the upgrading of related industries.

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