On January 18, 2026, Epoxy Molding Compound (EMC), a core material in the semiconductor packaging field, is emerging as a key force in the wave of domestic substitution. This thermosetting material, with epoxy resin as the matrix, phenolic resin as the curing agent, and supplemented by functional fillers such as silica powder, undertakes the important mission of protecting semiconductor chips from moisture, pollutants and other hazards by virtue of its excellent composite properties including protection, thermal conductivity and insulation.
    Statistics show that more than 90% of integrated circuit products rely on EMC for encapsulation and protection. Its performance stability is directly related to device yield and long-term chip operation reliability, making it a core supporting material for the sustainable development of the semiconductor industry. The composition system of EMC is complex: silica accounts for 60%-70%, providing hardness and heat resistance; bisphenol F epichlorohydrin polymer accounts for 15%-25%, laying the foundation for strength and toughness; and it is further combined with amine-based curing agents, modifiers and various additives to form a multi-functional composite system.
    However, the EMC industry faces high technical barriers. Formula development involves complex cross-reactions of various compounds, and any adjustment to the type or proportion of components may affect product performance. The R&D cycle of a mature new formula usually takes 1-3 years. Meanwhile, the encapsulation and molding process also encounters multiple technical challenges such as poor filling, air holes and cracking.
    In recent years, domestic enterprises have continuously increased R&D investment, making continuous breakthroughs in formula optimization and process improvement, and gradually breaking foreign technological monopolies. With the acceleration of the localization process of the semiconductor industry, the demand for domestic substitution of EMC has become increasingly urgent, and the market scale has continued to expand. By overcoming technical difficulties and improving product stability, domestic enterprises are gradually realizing the transformation from relying on imports to independent supply, providing key guarantees for the safety of China's semiconductor industry chain.

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