In February 2026, research results on the surface modification of inorganic fillers by silane coupling agents attracted industry attention. The modification mechanisms of KH-560 and KH-570, two mainstream models, were deeply analyzed, providing key technical support for improving the performance of epoxy resin-based composite materials. Inorganic fillers tend to agglomerate due to high surface energy, leading to high viscosity of epoxy resin systems and impaired thermal and mechanical properties, making improving dispersibility a key industry demand.
    At present, filler dispersion is divided into physical and chemical methods. Silane coupling agents have become core materials for chemical modification due to their bifunctional group characteristics. Their inorganic-philic functional groups form bonds with filler -OH, and organic-philic functional groups connect with epoxy resins to achieve efficient compatibility between the two phases. The modification of KH-560 and KH-570 undergoes four steps including hydrolysis and condensation, finally forming covalent bonds on the filler surface, converting it from hydrophilic to hydrophobic and lipophilic, greatly reducing the probability of agglomeration and improving the wettability and rheology of the system. This technology has been widely used in insulating materials, composite materials and other fields.

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