The organic silica gel adhesive with pure silicone resin as the main material is generally made of xylene as the solvent and adding inorganic fillers such as asbestos powder, mica powder, titanium dioxide and zinc oxide. It is cross-linked, polymerized and cured at high temperature (270°C), has excellent high temperature resistance, can be used for a long time at 400°C, and is suitable for non-structural bonding and sealing at high temperatures.
         Pure silicone adhesives are inconvenient to use due to the high curing temperature, and the bonding strength is not high, so they can only be used as non-structural adhesives. The use of one OH in epoxy, phenolic, and polyester can react with siloxane in silicone resin to introduce this type of resin to modify it, which can not only maintain the high temperature resistance of silicone resin adhesive, but also reduce its curing temperature and increase the glue. 接 Strength.