On January 17, 2026, Shanghai Aok  New Materials released a long-term thermal stability enhancement solution for polyimide (PI) high-temperature composite materials operating above 400℃, addressing the industry pain point of thermal oxidative decomposition of the material under extreme high temperatures.
    PI composite materials have long faced issues such as molecular chain breakage and cross-linking structure damage when serving above 400℃. The solution focuses on three aspects: molecular structure modification, composite antioxidant system construction, and process optimization. By introducing heat-resistant groups like aromatic and heterocyclic groups, compounding primary and secondary antioxidants with heat-resistant fillers, and combining gradient temperature curing with surface ceramization treatment, the chain reaction of thermo-oxidative aging is fundamentally inhibited.
    Performance verification shows that the modified material’s mass loss rate is reduced by over 50% at a constant temperature of 400℃. After 1000 hours of aging in 450℃ air atmosphere, the retention rates of flexural strength and tensile strength exceed 70%, far higher than the 30% level of unmodified materials. This technology provides a reliable material solution for high-temperature working conditions in aerospace, high-end equipment and other fields.

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