In 2026, the global electronic information technology is advancing in depth towards 5G, AI and cloud computing. The surging demand for high-frequency, high-speed and low-loss performance of PCB in high computing power scenarios has made hydrocarbon resin a core material for high-frequency copper clad laminates with its excellent dielectric properties, ushering in an explosive market growth. As a synthetic resin containing only C and H elements, its Dk is as low as 2.4 and Df as low as 0.0002, which can greatly reduce signal transmission delay and attenuation. With a water absorption rate of ≤0.06%, it maintains stable performance in humid environments and adapts to the demand of GHz-level high-frequency bands, showing significant technical advantages over traditional FR-4 epoxy resin.
At present, the high-end hydrocarbon resin market is still dominated by Japanese and American enterprises. Domestic enterprises such as East Material Technology and Shengquan Group are accelerating technological breakthroughs, and Meilian New Materials has even realized the mass production of M8/M9 grade products, breaking Japan's 20-year monopoly. With the proportion of hydrocarbon resin in M9 materials rising to 2/3, the demand for hydrocarbon resin used in overseas AI servers will exceed 3,000 tons in 2026 with an output value of nearly 4 billion yuan, and the global annual demand gap will reach 5,000 tons. While the localization substitution process is accelerating, the industry also faces challenges such as complex processing technology and high cost. In the future, resin modification and process optimization will become the key to development.

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